HELLER 1707EXL
A robust, mid-to-high volume SMT reflow soldering system designed for efficient and precise PCB assembly, supporting both air and nitrogen environments.
🎯 Key Specifications
Heating Zones: 7 top + 7 bottom heating zones, plus 1 cooling zone
Temperature Range: Standard 25–350 °C; optional high-temperature up to 450 °C
Conveyor: Left-to-right mesh or edge rail belt, adjustable for widths 50–460 mm (max PCB width ~22–26″)
Throughput: Up to ~24″ (60 cm) per minute, ideal for high-mix/medium-volume production
Electrical Power: 3-phase 208/240 V (standard), 100 A breaker; optional 380–480 V
Cooling Option: Air (standard) or nitrogen atmosphere; nitrogen systems consume ~700–900 SCFH
Energy Usage: Approx. 10–12 kW continuous
Dimensions & Weight: ~340 cm × 137 cm × 160 cm (134″ × 54″ × 63″); ~1,360 kg (3,000 lb)
Control System: PC-based Windows XP, supports >500 recipes and profiling, 5–7 TC inputs, data logging, password protection, LAN/EIA-485/SECS (optional)
Advanced Features:
Auto width adjust & hood lift
Auto chain oiling
Flux separation waterless cooling option
KIC or ECD profiling & real-time Cpk monitoring
