KohYoung KY-8030L Solder paste inspection
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KohYoung KY-8030L Solder paste inspection system
Vintage 2008
Features:
• True patented 3D volume measurement
• No false calls – no escapes – no shadow problems
• Highest accuracy and repeatability
• No PCB color sensitivity
• Solder paste printing optimization - at its best
Specifications
| Inspection Range | ||
| Metrology Capability | Volume, Area, Height, Offset, Bridging and Shape Deformity | |
| Types of Defects | Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset | |
| Measurement Principle | 3D Shadow Free Moiré | |
| Camera Technology | ||
| Camera | 2MPix | |
| XY Pixel Resolution | 20 µm | |
| Z Resolution | 0.37 µm | |
| Inspection Performance | ||
| Inspection Speed at 20 µm | Shadow Free Mode | 15.0 cm2/sec |
| High Speed mode | 19.7 cm2/sec | |
| Volume Repeatability (on a KY Calibration Target) | < 1% at 3 σ | |
| Volume Repeatability (on a PCB) | < 3% at 3 σ | |
| Height Accuracy (on a KY Calibration Target) | 2 µm | |
| Gage R&R (± 50 tolerance) | << 10 % at 6 σ | |
| Max. PCB Warp Compensation | ± 3.5 mm | |
| Max. Paste Height | 400 µm | |
| Min. Paste Deposit Size at 20 µm | Rectangle | 150 µm |
| Circle | 2000 µm | |
| Min. Distance between Paste Deposit | 100 µm (at 150 µm paste height) | |
| PCB Handling | ||
| Min PCB size | 50 x 50 mm | |
| Max PCB size | 510 x 510 mm | |
| PCB thickness | 0.4 ~ 5.0 mm | |
| Max PCB weight | 2 kg | |
| Bottom side clearance | 25.4 mm | |
| Conveyor Width Adjustment | Automatic | |
| Conveyor Fix Type | Front/Rear Fixed (Factory Setting) | |
| Conveyor Height | 970 ~ 870 mm | |
| System & Installation requirements | ||
| Supply | Electrical | 200 ~ 240VAC, 50/60 Hz Single phase |
| Air | 5 Kgf/cm2 | |
| Operating system | Microsoft Windows | |
| Weight and dimensions | ||
| Weght | 550 kg | |
| Dimensions (L x W x H in mm) | 1203 x 1000 x 1512 mm | |
For further information, please do not hesitate to contact us.
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| Disclaimer | 0 |