Koh Young KY-3030VAXL SPI
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Koh young KY-3030XVAXL 3D Solder paste inspection.
Vintage 2006
Features:
Hightly reliable and accurate
Specifications:
| Performances | ||
| Metrology capability | Volume, Height, XY position, Area | |
| Defect detection | Insufficient, Excessive/ Missing paste, bridging,shape deformity, paste displacement | |
| Field of view size | 32 x 24 mm | |
| XY table accuracy | 10 µm | |
| Typical load/unload & fiducial find time | 4 sec | |
| Height accuracy | 2 µm | |
| Repeatability | Height: ±1%* Volume: ± 1%* | |
| Min paste size | Rectangle: 150 µm | Circle: 200 µm |
| Max paste Height | 400 µm | |
| max pcb warp | ±5mm | |
| min distance between solders | 100 µm | |
| ||
| Statistical analysis | Histogram, X Bar & S Chart, Cp & Cpk, % gage R&R data, SPI Daily / weekly / monthly repots | |
| Inspection position training | Supports GERBER format (274 x, 274D) | |
| Vision algorithm | 3D/SFM (Shadow free moiré inferometry) | |
| Operating system | Microsoft Windows | |
| probe type | No shadow effect | |
| Camera | 2M B/W Digital camera (1600 x 1200) | |
| Dimensions (W x D x H) / Weight | 1200x1580x1570 mm / 900Kg | |
| Max. PCB size | 690 x 610 mm | |
For further information please do not hesitate to contact us.
| Specification | Description |
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| Disclaimer | 0 |
